Before You Apply Power to Frames 7...15

Before you place a frame 7…15 drive, bus supply, or common bus inverter into operation after a repair, follow these steps.
  1. For applicable products, open the protective caps (A) on the testpoints.
  2. For regenerative drives and bus supplies, measure the AC input and DC bus voltage at the following testpoint sockets (B) in the input bay to verify that there is no voltage present:
    • Use the circuit breaker output (CB1 SEC) testpoints R/L1, S/L2, and T/L3 to measure L to L and L to chassis GND.
    • Use the fused disconnect output (FD1 SEC) testpoints R, S, and T to measure L to L and L to chassis GND.
    • Use the DC bus testpoints +DC and –DC to measure +DC to –DC, +DC to chassis GND, and –DC to chassis GND.
  3. input bay testpoint locations
    ATTENTION:
    Risk of injury or death exists.
    To avoid an electric shock hazard, verify that the voltage on the bus capacitors has discharged completely before servicing. Use the test points provided to take these measurements:
    Verify that there is no DC bus voltage present by using the +DC to –DC testpoints on all power modules and by measuring +DC to –DC, +DC to GND, and –DC to GND.
  4. For common bus inverters, use the DC bus testpoints +DC and –DC on the front of the power modules (C frame 7, D frames 8…15) to measure the DC bus voltage of all power modules and verify that there is no voltage present on the bus capacitors. Measure +DC to –DC, +DC to chassis GND, and –DC to chassis GND.
    frames 7 and 8…15 power module testpoint locations
  5. For drives and bus supplies, measure the 240V AC control voltage at the appropriate terminals:
    • For frame 7 drives and bus supplies, measure terminals L and N on terminal block TB3.
      frame 7 terminal block TB3 240V AC testpoints
    • For frames 8…15 drives and bus supplies, in the input bay, measure terminals L and N on terminal block TB2.
      frames 8…15 input bay terminal block TB2 testpoints
    • For control bays, measure terminal L on FH2-2 and terminal N on terminal block TB4.
      control bay FH2-2 and terminal block TB4 testpoints
  6. For all products, in the frame 7 enclosure and frame 8…15 input bay perform phase to ground resistance tests to verify that there are no shorts on the following locations:
    • Use the circuit breaker output (CB1 SEC) testpoints R/L1, S/L2, and T/L3 to measure L to chassis GND.
    • Use the fused disconnect output (FD1 SEC) testpoints R, S, and T to measure L to chassis GND.
    • Use the DC bus testpoints +DC and –DC to measure +DC to chassis GND, and –DC to chassis GND.
  7. For all products, in the frame 7 enclosure and frame 8…15 power bay perform phase to ground resistance tests to verify that there are no shorts on the following locations:
    • Use the DC bus testpoints +DC and –DC on the front of the power modules to measure +DC to chassis GND, and –DC to chassis GND.
  8. When you have completed your measurements, replace the protective caps on the testpoints.
  9. If the measured value of any resistance test is less than 1 kΩ, troubleshoot to find the short, correct the problem, and repeat step 4.
  10. IMPORTANT: The minimum inside bend radius for fiber-optic cable is 50 mm (2 in.). Any bends with a shorter inside radius can permanently damage the fiber-optic cable. Signal attenuation increases as inside bend radius is decreased.
    fiber-optic cable bend radius example
  11. For any module or component that has been removed and reinstalled, complete the following:
    • Verify that all hardware connections have been replaced and are properly torqued.
    • If applicable, verify that all fiber-optic cables are connected at both ends and properly secured and supported by cable ties along their entire length when routed between enclosures.
    • Verify that all interconnection wire harnesses are connected at both ends and properly supported by cable ties along their entire length when routed between enclosures.
  12. When service has been completed on the control pod, verify that all fiber-optic, and control power and I/O wires are connected and properly secured and supported by cable ties along their entire length when routed between enclosures.
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